STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
February 20 2020 - 4:00AM
STMicroelectronics and TSMC Collaborate to Accelerate Market
Adoption of Gallium Nitride-Based Products
- Accelerates the development and delivery of advanced power GaN
solutions to market
- Leverages Automotive-market expertise of ST and the foundry
leadership of TSMC
- Improves wide bandgap efficiency for better energy efficiency
in power conversion applications
Geneva, Switzerland and Hsinchu, Taiwan R.O.C., February
20, 2020 – STMicroelectronics (NYSE:STM), a global
semiconductor leader serving customers across the spectrum of
electronics applications, and TSMC (TWSE:2330, NYSE: TSM), the
world’s largest dedicated semiconductor foundry, are collaborating
to accelerate the development of Gallium Nitride (GaN) process
technology and the supply of both discrete and integrated GaN
devices to market. Through this collaboration, ST’s innovative and
strategic GaN products will be manufactured using TSMC’s leading
GaN process technology.
GaN is a wide bandgap semiconductor material which offers
significant benefits over traditional Silicon-based semiconductors
for power applications. These benefits include greater energy
efficiency at higher power, leading to a substantial reduction in
parasitic power losses. GaN technology also allows the design of
more compact devices for better form factors. Additionally,
GaN-based devices switch at speeds as much as 10X faster than
Silicon-based devices while operating at higher peak temperatures.
These robust and intrinsic material characteristics make GaN
ideally suited for broad-based adoption in evolving automotive,
industrial, telecom, and specific consumer applications across both
the 100V and the 650V clusters.
Specifically, Power GaN and GaN IC technology-based products
will enable ST to provide solutions for medium and high-power
applications with better efficiency compared to silicon
technologies on the same topologies, including automotive
converters and chargers for hybrid and electric vehicles. Power GaN
and GaN IC technologies will help accelerate the megatrend of the
electrification of consumer and commercial vehicles.
“As a leader in both wide bandgap semiconductor technology and
in power semiconductors for the demanding automotive and industrial
markets, ST sees significant opportunity in accelerating the
development and delivery of GaN process technology and bringing
power GaN and GaN IC products to the market. TSMC is a trusted
foundry partner that can uniquely meet the challenging reliability
and roadmap evolution requirements of ST’s target customers,” said
Marco Monti, President of STMicroelectronics’ Automotive and
Discrete Group. “This cooperation complements our existing
activities on power GaN undertaken at our site in Tours, France and
with CEA-Leti. GaN represents the next major innovation in Power
and Smart Power electronics, as well in process technology”.
“We look forward to collaborating with ST and bring the
applications of GaN power-electronics to Industrial and Automotive
Power Conversion,” said Dr. Kevin Zhang, Vice President of Business
Development at TSMC. “TSMC’s leading GaN manufacturing expertise,
combined with STMicroelectronics’ product design and
automotive-grade qualification capabilities, will deliver great
energy efficiency improvement for industrial and automotive power
conversion applications that are more eco-friendly and help
accelerate the electrification of vehicles.”
ST expects the delivery of first samples of power GaN discrete
devices to its key customers later this year, followed by GaN IC
products within a few months.
About STMicroelectronics ST is a global
semiconductor leader delivering intelligent and energy-efficient
products and solutions that power the electronics at the heart of
everyday life. ST’s products are found everywhere today, and
together with our customers, we are enabling smarter driving and
smarter factories, cities and homes, along with the next generation
of mobile and Internet of Things devices. By getting more from
technology to get more from life, ST stands for life.augmented.
In 2019, the Company’s net revenues were $9.56 billion, serving
more than 100,000 customers worldwide. Further information can be
found at www.st.com.
About TSMCTSMC pioneered the pure-play foundry
business model when it was founded in 1987, and has been the
world’s largest dedicated semiconductor foundry ever since. The
company supports a thriving ecosystem of global customers and
partners with the industry’s leading process technology and
portfolio of design enablement solutions to unleash innovation for
the global semiconductor industry.
TSMC serves its customers with global capacity of about 13
million 12-inch equivalent wafers per year in 2020, and provides
the broadest range of technologies from 2 micron all the way to
foundry’s most advanced processes, which is 7-nanometer today. TSMC
is the first foundry to provide 7-nanometer production capabilities
and the first to commercialize Extreme Ultraviolet (EUV)
lithography technology in delivering customer products to market in
high volume. TSMC is headquartered in Hsinchu, Taiwan. For more
information about TSMC please visit http://www.tsmc.com.
STMicroelectronics contactsCéline BerthierGroup
VP, Investor RelationsTel: +41 22 929 58 12
celine.berthier@st.com
Alexis BretonCorporate External CommunicationsTel: + 33 6 59 16
79 08 alexis.breton@st.com
TSMC Media ContactsNina KaoHead of PR
DepartmentTel: 886-3-5636688 ext.7125036Mobile:
886-988-239-163nina_kao@tsmc.com
Michael KramerPR DepartmentTel: 886-3-5636688 ext.7125031Mobile:
886-988-931-352pdkramer@tsmc.com
- ST TSMC GaN_press release _ FINAL FOR PUBLICATION
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